2026-03-06
Beijing, China – November 28, 2025 — successfully hosted its 2025 Data Center Annual Forum under the theme “Watts to Megawatts, Intelligence Without Boundaries” in Beijing on November 27. The event gathered hundreds of industry leaders, technical experts, and ecosystem partners from across the globe to explore the future of AI-driven compute infrastructure—centered on high-density power delivery, energy efficiency, global deployment, and scenario-specific innovation.
[2025 Data Center Annual Forum gathered global experts in Beijing to shape the future of AI-ready infrastructure. ]
At the heart of the forum, made a historic announcement: the global launch of the MR9.0, the world’s first 200kW high-density UPS module, certified by China’s Tai’er Certification Center with the industry’s first 1.2MW UPS system certificate based on 200kW modules.
Designed explicitly for the unique demands of AI workloads—characterized by millisecond-level pulses, sustained high loads, and unpredictable idling—the MR9.0 marks a paradigm shift in data center power architecture. It addresses three critical industry bottlenecks:
· Unprecedented Power Density: At just 4U in height, the 200kW module achieves a record-breaking 47W/in³, 20% higher than current industry benchmarks. A single cabinet delivers 1.2MW in only 0.8m², enabling 1.5MW per square meter—a 39% reduction in footprint compared to conventional solutions.
· AI-Optimized Resilience: The system sustains over 180% rated load for 300 milliseconds without transfer, ensuring uninterrupted AI training and large-model inference during extreme transient spikes.
· Ultra-High Efficiency: Leveraging third-generation semiconductor devices and proprietary “Magnetic Magic Cube” design, the MR9.0 achieves 98% double-conversion efficiency, with up to 99.2% in WECO mode combined with intelligent sleep functionality.
[receives the world’s first 1.2MW UPS certification (based on 200kW modules) from Tai’er Certification Center, validating the MR9.0’s industry-leading performance.]
“This isn’t an incremental upgrade—it’s a foundational reimagining of power infrastructure for AI,” said Wu Qingbin, Director of Data Center Products at. “As AI chips evolve along dual tracks—global high-end and domestic acceleration—our power systems must be equally adaptive, dense, and intelligent. The MR9.0 is built from the ground up for the rhythm of AI.”
[Wu Qingbin, Director of Data Center Products at, unveils the MR9.0 and explains how it’s engineered for the unique rhythm of AI workloads.]
The launch underscores four-decade legacy in power electronics and over ten years of data center operational expertise. Building on its integrated capabilities across “power, cooling, scenarios, and services,” has now established a full-stack, full-lifecycle solution framework—from product innovation to vertical industry deployment—tailored for next-generation intelligent computing.
